DeepMaterial Industrial Adhesive Pruducts
Deepmaterial is a the manufacturer of epoxy adhesives including hardeners, metalbond, and metal filled resins. Structural, toughened medium viscosity, and non-sag adhesives are also offered. Some adhesives are resistant to thermal shock, chemical, vibration dampening, and impact. Suitable for metals, plastics, wood, and ceramics. Serves electronics, aerospace, automotive, tooling, marine, and construction industries. REACH and RoHS compliant. FDA approved. UL listed. Meets military specifications. We are the one of best adhesive manufacturers in China.
DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
DeepMaterial offer different kinds of products about industrial adhesive for electric, UV curing UV adhesive series, reactive type of hot melt adhesive and pressure sensitive hot melt adhesiveseries, epoxy-based chip underfill and COB encapsulation materials series, circuit board protection potting and conformal coating adhesive series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional protective film series, semiconductor protective film series.
Semiconductor Packaging & Testing UV Viscosity Reduction Special Film
Product Specification Parameters Product Model Product Type Thickness Peel Force Before UV Peel Force After UV DM-208A PO+UV tack reduction 170μm 800gf/25mm 15gf/25mm DM-208B PO+UV tack reduction 170μm 1200gf/25mm 20gf/25mm DM-208C PO+UV tack reduction 170μm 1500gf/25mm 30gf/25mm
LED Scribing/Turning Crystal/Reprinting Semiconductor PVC Protective Film
Product Specification Parameters Product Model Product Type Thickness Peeling Force DM-TDS-202RB PVC+acrylic 80μm 95 gf/25mm DM-TDS-202RT PVC+acrylic 80μm 95 gf/25mm DM-TDS-204RB PVC+acrylic 80μm 66 gf/25mm DM-TDS-204RT PVC+acrylic 80μm 66 gf/25mm
Screen Protector
Product Specification Parameters Product Model Product Type Thickness Peeling Force Transmittance Haze Cape Verdict DM-302 PET+OCA Thickness 70μm 1600 gf/25mm 93% <1.5% * DM-303 PET+TPU Thickness 125μm 800 gf/25mm >90% <1% 108°
Anti-static Optical Glass Protection Film
Product Specification Parameters Product Model Product Type Thickness Peeling force DM-310 PET+acrylic 60μm <200gf/25mm DM-332 PET+Silicone 150μm 18~25gf/25mm DM-333 PET+Silicone 150μm 18~25gf/25mm DM-PTU0502E PET+PU 60μm 3~6gf/25mm DM-PTU0501E PET+PU 60μm 3~6gf/25mm
Optical Glass UV Adhesion Reduction Film
Product Specification Parameters Product Model Product Type Thickness Peel Force Before UV Peel Force After UV DM-2005 PET+UV tack reduction 65μm 1800gf/25mm 15gf/25mm DM-2010 PET+UV tack reduction 120μm 1800gf/25mm 15gf/25mm DM-206 PVC+UV tack reduction 90μm 350gf/25mm 8gf/25mm
Epoxy Encapsulant
Product Specification Parameters Product Model Product Name Color Typical Viscosity (cps) Curing time Use Distinction DM-6016E Epoxy potting adhesive Black 58000~62000 @ 150℃ 20min PCB board sensitive inserts, transistors, smart card IC card packaging For applications where excellent handling properties are required. Cured materials exist for severe thermal shock and provide continuous heat resistance to […]
PUR structural adhesive
Product Specification Parameters Product Model Color Curing Method Melt Viscosity (mPa.s/100°C) Opening Hours (min) Hardness(D) Elongation(%) Tensile Shear Strength (MPa) Product Features DM-6542 Light yellow Moisture curing 5000±1500 3±1 31±5 ≥810 ≥5 1.Provides excellent initial strength 2.Excellent elongation 3.High curing strength DM-6535 Porcelain white Moisture curing 9000±2000 1±0.5 35±5 ≥800 ≥6 1.Provides instant high initial […]
Two-component Epoxy Adhesive
Product Specification Parameters Product Model Product name Color Typical Viscosity (cps) Curing time Use DM-630E AB epoxy adhesive Colorless to slightly yellowish liquid 9000-10,000 120min Suitable for applications requiring optical transparency, excellent structural, mechanical and electrical insulation, for bonding, small parts potting, riveting and laminating. Can bond most materials including glass, fiber optics, ceramics, metals […]
Low temperature curing epoxy adhesive for sensitive devices and circuit protection
Product Specification Parameters Product Model Product Name Color Typical Viscosity (cps) Curing Time Use Distinction DM-6128 Low temperature curing epoxy adhesive Black 7000-27000 @80℃ 20min 60℃ 60min CCD/CMOS/Sensitive Electronic Components Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable for low temperature curing and can provide good […]
UV Moisture Dual Curing Adhesive
Product Specifications & Parameters Product Name Product Name 2 Color Typical Viscosity (cps) Mixing Ratio Initial Fixation Time / Full Fixation TG/°C Hardness/D Temperature Resistance/°C Stored Typical Product Applications DM-6060F UV moisture dual curing adhesive Translucent Light Blue 18000 Single component <10s@100mW/cm 2Humidity 8 days 75 76 -55°C-120°C 2-8°C Non-flow, UV/moisture curing encapsulation for topical circuit […]
Conductive silver glue for chip packaging and bonding
Product Specification Parameters Product Series Product Name Application characteristics Conductive silver glue DM-7110 The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic glue dispensing, […]
Epoxy underfill chip level adhesive
Product Specification Parameters Product Model Product Name Color Typical Viscosity (cps) Curing Time Use Distinction DM-6513 Epoxy underfill bonding adhesive Opaque Creamy Yellow 3000~6000 @ 100℃ 30min 120℃ 15min 150℃ 10min Reusable CSP (FBGA) or BGA filler One-component epoxy resin adhesive is a reusable filled resin CSP (FBGA) or BGA. It cures quickly as soon […]
