Product Specification Parameters
|Good adhesion||High production efficiency (fast curing)|
|Fast delivery of high throughput applications||Suitable for low temperature curing applications|
Low temperature curing adhesive is a single component heat curing epoxy resin. It is fast curing at low temperature and is used for the assembly of CCD or CMOS components and VCM motors. This product is suitable for low temperature curing and has good adhesion to a wide range of materials in a very short period of time. It is especially suitable for thermal components where low temperature curing is required.