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Malunga ne-Industrial Adhesives

I-Shenzhen Deepmaterial Technologies Co., Ltd ngumvelisi ohamba phambili wobugcisa bokuncamathelisa kwimizi-mveliso onobuchule bokwenza ukwakheka okuncamathelayo kuyo nayiphi na imveliso okanye isicelo. I-Deepmaterial Adhesives inamandla okwenza izinto zokuncamathelisa ukusuka kwi-viscosity, amandla ebhondi, ubushushu besicelo, kunye nokunye. Izinto ezincamathelayo kwimizi-mveliso yethu ziquka izinto ezincamathelayo ezinyibilikayo ezishushu ezinyibilikayo, izinto ezincamathelayo ngoko nangoko, izinto ezincamathelayo ezinoxinzelelo kuxinzelelo, iintambo zokuncamathelisa, izinto ezincamathelayo zesakhiwo kunye nokunye, ukuhambisa ukusebenza kakuhle, lula, kunye nokuthembeka nokuba ufuna imveliso okanye isicelo.

Izinto ezincamathelayo kwimizi-mveliso zizikhompawundi ze-organic kunye ne-inorganic chemicals ezisetyenziselwa ukujoyina amacandelo. Iimveliso ziquka i-acrylic, i-epoxy, i-hot melt, i-polyurethane, i-silicone, i-thermoset, kunye ne-Adhesives yokunyanga ye-UV, kunye ne-sealants ye-industrial. Uninzi lwee-adhesives zemizi-mveliso zisetyenziselwa ukuqinisa izicelo. I-industrial sealants isetyenziselwa ukuzalisa izikhewu phakathi kwe-seams, okanye kwiindawo; kunye nokuqulatha ulwelo, ukuthintela ukuvuza, kunye nokuthintela ukungena kwezinto ezingafunekiyo.

Ukusuka kwi-adhesives esele ilungisiwe, iteyiphu kunye nokuncamatheliswa kweelebhile, ukupakishwa, iimoto kunye ne-electronics, okanye ukwakheka ngokwesiko. Izinto zokuncamathelisa kwimizi-mveliso zisetyenziselwa ukudibanisa i-substrates ezahlukeneyo ngokubambelela (ukudibanisa umphezulu) kunye nokudibanisa (amandla angaphakathi).

I-Deepmaterial Adhesives, Sealants & Fillers for Electronics Technologies

I-Electronics innovation naphi na ebomini bethu. Njengokuqhuba i-hybrid kunye nezithuthi zombane ezineenkqubo zoncedo lwabaqhubi, sebenzisa ii-smartphones ukulawula umsebenzi wethu kunye nokudlala, ukubona ihlabathi elitsha nge-augmented reality (AR) ii-headsets, zonwabele ulonwabo olulolwakho kwiscreen ngelixa ubhabha ngenqwelomoya, kwaye ulawule indawo yethu yokuhlala. ngezixhobo eziqhagamshelwe ekhaya. Kodwa, kwiminyaka eyadlulayo, uninzi lwezi zinto zintsha yayiliphupha nje.

I-Deepmaterial yinkulumbuso yomvelisi wezixhobo kunye nomthengisi wendibano ye-elektroniki kunye nemizi-mveliso yokupakisha ye-semiconductor. Uqulunqo lwethu oluphezulu lubandakanya uluhlu lweemveliso eziququzelela ukuqhagamshelwa kombane, ukunika ingqibelelo yesakhiwo, ukunika ukhuseleko olubalulekileyo, kunye nokudlulisa ubushushu bokusebenza okuthembekileyo. Siyazingca ngokwenza iimveliso ezingakumbi ezixhasa ubugcisa be-elektroniki bamva nje.

I-Adhesives inika ibhondi eyomeleleyo ngexesha lokuhlanganisana kwe-elektroniki ngelixa likhusela amacandelo kumonakalo onokwenzeka.
Iinguqulelo zakutsha nje kumzi-mveliso we-elektroniki, njengeemoto ezixutyiweyo, izixhobo zombane eziphathwayo, usetyenziso lwezonyango, iikhamera zedijithali, iikhompyutha, unxibelelwano ngocingo, kunye neeseti zentloko ezongeziweyo, zichukumisa phantse zonke iindawo zobomi bethu. Izinto zokuncamathelisa zombane ziyinxalenye ebalulekileyo yokudibanisa la macandelo, ngoluhlu lwetekhnoloji yokuncamathelisa eyahlukeneyo ekhoyo ukujongana neemfuno ezithile zesicelo.

I-Adhesives ibonelela ngebhondi eyomeleleyo ngelixa ikhusela amacandelo ngokuchasene nemiphumo eyonakalisayo yokungcangcazela okugqithisileyo, ubushushu, ukufuma, ukubola, ukothuka komatshini, kunye neemeko zokusingqongileyo ezigqithisileyo. Bakwabonelela ngeepropathi ezishushu kunye nezombane, kunye nobuchule bokunyanga kwe-UV.

IiSystems zeBanga leKhompyutha ezinzulu ziNxibelelanisa iiPropati zeNtsebenzo eziBalaseleyo

Iimveliso kulula ukuzisebenzisa kwaye ziyafumaneka ukuze zisetyenziswe kwizifaki-zicelo ezifanelekileyo (kubandakanywa iisirinji ezixutyiweyo nezikhenkcezisiweyo kwiinkqubo zamacandelo amabini epoxy). Iipropati zamabakala athile ziquka:
* Amandla ebhondi ephezulu kwii-substrates ezifanayo nezingafaniyo
*Uxinzelelo oluphantsi
*Ukushisa okuphezulu / okuphantsi kobushushu bokusebenza
*Unyango olukhawulezayo
*Ukumelana namanzi kunye neekhemikhali ezininzi
*I-coefficient ephantsi yokwandiswa kwe-thermal

IiNkqubo zeSilicone zibonelela ngoKhuseleko oluGqwesileyo kuxinzelelo lweMechanical kunye nokuguquguquka kobushushu

Ibakala elinye kunye nesibini secandelo le-elektroniki linozinzo oluphezulu lwe-thermal, imoduli ephantsi yokuqina, iipropathi eziphezulu ze-dielectric. Ezinye iimpawu eziluncedo zokukhetha iikhompawundi ze-silicone zezi zilandelayo:
*Ukushwabana okuphantsi
*I-Thermal kunye ne-conductivity yombane
*Ukukhupha umoya okuphantsi
*Ukungasebenzi kwekhemikhali
*Ukufunxa ukufuma okuphantsi
*Ukungcangcazela kumanzi

Akukho mxube we-UV / i-Light ebonakalayo yokunyanga iiCompounds zoKhuselo lwaMacandelo e-Electronic

Ukunyanga ngokukhawuleza inxalenye enye yeemveliso ze-solvent zasimahla zibonisa ukomelela kwebhondi ephezulu, ukuxhathisa kokusingqongileyo kwizicelo zendibano ye-elektroniki. Iikhompawundi ze-viscosity ezisezantsi zokugquma ngokusesikweni kunye neekhompawundi ze-viscosity eziphezulu ze-glob top applications zenzelwe ukuxhathisa i-abrasion, ukufuma, ukungcangcazela kunye nokuvezwa kwebhayisekile eshushu.

Izincamathelisi zokunyanga ukukhanya, ii-coatings kunye ne-encapsulants zisetyenziswa kwishishini lokuvelisa i-electronics ngokunyuka rhoqo ngenxa yokuba zihlangabezana neemfuno zemathiriyeli kunye nokucubungula ngaphakathi kolu shishino. Ezo zinto zibandakanya iimfuno zokusingqongileyo (izinyibilikisi ezonakalisa indalo kunye nezongezo azifunwa), ukuphuculwa kwemveliso-yesivuno kunye neendleko zemveliso. Izincamathelisi zokunyanga ukukhanya kulula ukuzisebenzisa, kwaye zinyangwa ngokukhawuleza ngaphandle kwesidingo sokunyanga ubushushu obuphakamileyo.

I-adhesives ngokuqhelekileyo i-acrylic-based formulations kwaye iqulethe i-photo-initiators ethi, xa iqhutywe yimitha ye-ultraviolet, yenza i-radicals yamahhala ukuqalisa inkqubo yokwenza i-polymer (ukunyanga). Ukukhanya kwe-Ultraviolet kufuneka kukwazi ukungena kwi-resin enganyangekiyo - i-drawback ye-adhesives lightcuring. Iidiphozithi zentlaka ezinombala omnyama, ezingafikelelekiyo okanye ezityebileyo kunzima ukunyangeka.

Ukongeza kwi-potting, kukho ezinye iindlela zokufakela izinto ze-elektroniki, ezizezi ukuphosa kunye nokubumba. Ukuphosa kusebenzisa uhlobo olufanayo lweerensi zokuncamathelisa njenge-potting, nangona isitya (i-casing yangaphandle) sihlala sisuswa emva kokuba i-resin iphilisiwe, ngokungafaniyo nenkqubo yokubumba apho isitya siba yinxalenye ebalulekileyo yecandelo. Ukubunjwa kudla ngokubandakanya ukutofwa kweereyini ze-thermoplastic ezinyibilike kwangaphambili zibe ngumbumba oqulethe izinto ze-elektroniki okanye iisekethe.

Izinto zokuncamathelisa zombane

Ngokwemvelo yazo, uninzi lwezinto ezincamathelayo, zombini kunye ne-inorganic, azikho umbane. Oku kusebenza kwiintlobo eziphambili ezisetyenziswa kwizicelo ze-elektroniki ezifana ne-epoxies, i-acrylics, i-cyanoacrylates, i-silicones, i-urethane acrylates kunye ne-cyanoacrylates. Nangona kunjalo, kwizicelo ezininzi, kubandakanywa iisekethe ezidibeneyo kunye nezixhobo zokunyuka kwendawo, i-adhesives conductive conductive iyadingeka.

Indlela eqhelekileyo yokuguqula i-adhesives non-conductive adhesives kwi-conductive material conductive kukongeza i-filler efanelekileyo kwizinto ezisisiseko; ngokuqhelekileyo le yokugqibela yiresin epoxy. Izihluzi eziqhelekileyo ezisetyenziselwa ukubonelela nge-conductivity yombane yisilivere, i-nickel kunye nekhabhoni. Isilivere yeyona isetyenziswa kakhulu. I-conductive adhesives ngokwayo i-liquid okanye i-pre-form (iifilimu ezinamathele ezomeleziweyo zifa-zinqunyulwe ngaphambi kokuba ziboshwe kwimilo efunekayo).

I-adhesives conductive thermally

I-Miniaturization ye-electronic circuitry ingabangela iingxaki zokunyuka kobushushu, ezinokubangela ukusilela kwangaphambi kwexesha kumacandelo e-elektroniki ukuba ubushushu bawo bokusebenza bugqithile. I-adhesive conductive thermally conductive ingasetyenziselwa ukubonelela ngendlela yokuhambisa ukushisa, i-fastening transistors, i-diodes okanye ezinye izixhobo zamandla kwiindawo ezifanelekileyo zokushisa ukushisa ukuqinisekisa ukuba ukufudumala okunjalo akwenzeki.

I-Metallic (i-electrically conductive) okanye i-non-metallic (i-insulating) i-powders idityaniswe kwi-adhesive formulation yokwenza i-high-viscosity (i-paste) i-adhesives, ehamba phambili kakhulu ye-therrmally (ngokuthelekiswa ne-adhesives engagcwaliswanga). Iinkqubo eziqhelekileyo ze-thermal conductive zenziwe nge-epoxy, i-silicone kunye ne-acrylics.

Ukusuka kwi-Special wire-coating kunye ne-coil encapsulation ukuya kwi-audio component assembly kunye nokunyuka, i-Deepmaterial inikezela ngeemveliso ezahlukeneyo zokuncamathelisa ukusebenza okuphezulu kwizicelo zombane kwimarike yendibano.