tsananguro
Chigadzirwa Rondedzero Parameter
| chigadzirwa
mhando |
chigadzirwa
zita |
ruvara |
Typical
Viscosity (cps) |
Kurapa nguva |
shandisa |
Kusiyanisa |
| DM-6016E |
Epoxy potting adhesive |
Nhema |
58000 ~ 62000 |
@150 ℃ 20min |
PCB bhodhi inopinza inopinza, transistors, smart kadhi IC
kadhi kurongedza |
Zvemaapplication uko kwakanakisa kubata zvivakwa zvinodiwa. Zvinhu zvakarapwa zviripo zvekuvhunduka kwakanyanya kupisa uye zvinopa kuenderera kwekupisa kwe177 ° C. Kunyanya akakodzera kurongedza ma transistors uye akafanana semiconductors, inogona kushandiswa kurongedza yewachi yakasanganiswa maseketi, component encapsulation adhesive, yePCB board inonzwa inopinza, transistors, smart kadhi IC kadhi kurongedza. |
| DM-6058E |
Epoxy potting adhesive |
Nhema |
50,000 |
@120 ℃ 12min |
Packaging ye
sensors uye
zvakarurama
Components |
Ichi chigadzirwa chinopa yakanakisa kuchengetedzwa kwemamiriro ekunze uye kupisa kwemidziyo yekurongedza, uye inonyanya kukodzera kuchengetedzwa kwema sensors uye chaiyo zvikamu zvinoshandiswa munzvimbo dzakaomarara senge mota. |
| DM-6061E |
Epoxy potting adhesive |
Nhema |
32500 ~ 50000 |
@ 140°C 3H |
PCB bhodhi inopinza inopinza, transistors, smart kadhi IC
kadhi kurongedza |
Component encapsulation glue, inoshandiswa kurongedza plug-in PCB mabhodhi, yakanakisa viscosity kugadzikana, nyore kudzora saizi yeglue. Mushure mekupfuura 1000H tembiricha / humidity / kutsauka bvunzo uye kupisa kutenderera kusvika 125 ℃. Iyo yakakosha viscosity yakagadzikana pa 25 ° C inopa saizi inodzorwa zviri nyore uchishandisa yakajairwa nguva / kudzvanywa midziyo yekuparadzira. |
| DM-6086E |
Epoxy potting adhesive |
Nhema |
62500 |
@120℃ 30min 150℃ 15min |
IC uye Semiconductor Packaging |
Inoshandiswa mumashandisirwo anoda zvakanakisa kubata zvivakwa. Kune IC uye semiconductor packaging ine yakanaka kupisa kutenderera kugona, zvinhu zvinokwanisa kutsungirira kupisa kwemhepo kuenderera kusvika 177 ° C. |
Product Features
· Inopa kuchengetedzwa kwepamusoro kwezvakatipoteredza uye kupisa
· Yakanakisa viscosity kugadzikana, nyore kudzora kugovera saizi
· Yakanaka kupisa bhasikoro kugona, zvinhu zvinokwanisa kumira kutyisa kusvika 177 ° C nguva dzose.
· Yezvikumbiro zvinoda hukuru hwekugadzirisa
Mutengo Unobatsira
Chigadzirwa ndeye epoxy resin encapsulant, yakakodzera kune maapplication anoda yakanakisa kubata zvivakwa. Component encapsulation glue, inoshandiswa kuPCB board inonzwisisika plug-in packaging, yakanakisa viscosity kugadzikana, nyore kudzora saizi yeglue. Epoxy resin encapsulants yakagadzirirwa zvikumbiro zvinoda zvakanakisa kubata zvivakwa. Inoshandiswa IC uye semiconductor packaging, ine yakanaka kupisa kutenderera kugona, uye zvinhu zvinokwanisa kutsungirira kuvhunduka kwekushisa kusvika 177 ° C.
