DeepMaterial Industrial Adhesive Pruducts

Deepmaterial inogadzira epoxy adhesives zvinosanganisira hardener, metalbond, uye simbi yakazara resins. Zvimiro, zvakaomesesa zvepakati viscosity, uye zvisiri-sag zvinonamira zvinopihwa zvakare. Mamwe anonamira anoshingirira kuvhundutsa kwemafuta, makemikari, kunyorova kwekudengenyeka, uye kukanganisa. Inokodzera simbi, mapurasitiki, huni, uye ceramics. Inoshanda zvemagetsi, aerospace, mota, zvishandiso, zvemugungwa, uye maindasitiri ekuvaka. REACH uye RoHS inoenderana. FDA yakabvumidzwa. UL yakanyorwa. Inosangana nezvinodiwa zvehondo. Isu tiri vamwe veakanakisa adhesive vagadziri muChina.

DeepMaterial yakagadzira maindasitiri anonamira ekurongedza uye kuyedza, edunhu bhodhi-level adhesives, uye anonamira ezvigadzirwa zvemagetsi. Zvichienderana nezvinonamira, yakagadzira mafirimu ekudzivirira, semiconductor mafirita, uye zvinhu zvekurongedza zve semiconductor wafer processing uye chip kurongedza uye kuyedzwa.

Kupa zvekunamira zvemagetsi uye zvitete-firimu zvemagetsi zvekushandisa zvigadzirwa uye mhinduro kumakambani ekutaurirana, makambani emagetsi evatengi, semiconductor ekurongedza uye makambani ekuyedza, uye vagadziri vemidziyo yekutaurirana, kugadzirisa vatengi vataurwa pamusoro mukudzivirira, chigadzirwa chakanyanya-chaiyo bonding. , uye kushanda kwemagetsi.

DeepMaterial inopa mhando dzakasiyana dzezvigadzirwa nezve maindasitiri anonamira emagetsi, UV kurapa UV adhesive akateedzana, reactive rudzi rwekupisa kunyunguduka adhesive uye kudzvanywa kusinganzwisisike inopisa melt adhesiveseries, epoxy-based chip underfill uye COB encapsulation zvinhu zvakatevedzana, redunhu bhodhi kudzivirira potting uye conformal coating adhesive. series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional protective film series, semiconductor protective film series.

Microencapsulated Self-activating Fire Kudzimisa Gel Kubva Self Contained Fire Suppression Material Manufacturer.

Microencapsulated Self-activating Fire Kudzima Gel Coating | Sheet Material | Iine Power Cord Cables Deepmaterial inozvigadzira inodzima moto inogadzira zvinhu muChina, yakagadzira akasiyana-siyana ega-excited perfluorohexanone yekudzima moto zvinhu kuti itarise kupararira kwekupisa kunotiza uye kudzikisira kudzora mumabhatiri emagetsi matsva, kusanganisira mashiti, machira, potting glue. uye kumwe kunakidza-kudzimisa moto […]

Semiconductor Packaging & Kuedza UV Viscosity Reduction Special Firimu

Product Specification Parameters Chigadzirwa Model Chigadzirwa Type Hukobvu Peel Simba Pamberi peUV Peel Force Mushure meUV DM-208A PO+UV tack kuderedza 170μm 800gf/25mm 15gf/25mm DM-208B PO+UV tack kuderedza 170μm 1200μm 25g20g 25mm208g 170mm 1500mm 25gf/30mm 25gf/XNUMXmm + UV tack kuderedza XNUMXμm XNUMXgf/XNUMXmm XNUMXgf/XNUMXmm

LED Kunyora / Kushandura Crystal / Kudhindazve Semiconductor PVC Dziviriro Firimu

Product Speciation Parameters Chigadzirwa Model Chigadzirwa Type Hukobvu Peeling Force DM-TDS-202RB PVC+acrylic 80μm 95 gf/25mm DM-TDS-202RT PVC+acrylic 80μm 95 gf/25mm DM-TDS-204RB PVC+acrylic 80μf/66mm 25mm -TDS-204RT PVC+acrylic 80μm 66 gf/25mm

Screen protector

Product Specification Parameters Chigadzirwa Model Chigadzirwa Type Hukobvu Peeling Force Transmittance Haze Cape Mutongo DM-302 PET+OCA Ukobvu 70μm 1600 gf/25mm 93% <1.5% * DM-303 PET+TPU Hukobvu 125μm 800%25f/90mm > 1°

Anti-static Optical Glass Dziviriro Firimu

Product Specification Parameters Chigadzirwa Model Chigadzirwa Type Hukobvu Peeling simba DM-310 PET+acrylic 60μm <200gf/25mm DM-332 PET+Silicone 150μm 18~25gf/25mm DM-333 PET+Silicone 150μm 18PETU+25mm DM-PETU25mm PT/PETU+0502mm 60~3mm PET+Silicone PU 6μm 25~0501gf/60mm DM-PTU3E PET+PU 6μm 25~XNUMXgf/XNUMXmm

Optical Glass UV Adhesion Reduction Firimu

Chigadzirwa Specification Parameters Chigadzirwa Model Chigadzirwa Rudzi Hukobvu Peel Simba Pamberi peUV Peel Simba Mushure meUV DM-2005 PET+UV tack kuderedza 65μm 1800gf/25mm 15gf/25mm DM-2010 PET+UV tack kuderedza 120μm 1800g25mm 15mm 25g206mm DM90/350mm 25g 8mm VC25gf/XNUMXmm + UV tack kuderedza XNUMXμm XNUMXgf/XNUMXmm XNUMXgf/XNUMXmm

Epoxy Encapsulant

Chigadzirwa Chinotsanangurwa Maparamita Chigadzirwa Model Chigadzirwa Zita Rudzi Rwakajairika Viscosity (cps) Kurapa nguva Shandisa Distinction DM-6016E Epoxy potting adhesive Black 58000 ~ 62000 @ 150 ℃ 20min PCB bhodhi rinonzwa kupinza, transistors, smart kadhi IC kadhi kurongedza Kune maapplication ari uko kwakanakisa kubata zvivakwa. zvinodiwa. Zvinhu zvakarapwa zviripo zvekuvhunduka kwakanyanya kupisa uye zvinopa kuenderera kwekupisa kupisa ku […]

PUR structural adhesive

Product Specification Parameters Chigadzirwa Mutevedzeri Ruvara Kurapa Nzira Melt Viscosity (mPa.s/100°C) Maawa ekuvhura (min) Kuoma (D) Elongation(%) Tensile Shear Strength (MPa) Chigadzirwa Zvimiro DM-6542 Chiedza yeyero Hunyoro kurapa 5000±1500 3±1 31±5 ≥810 ≥5 1.Inopa yakanakisa simba rekutanga 2.Excellent elongation 3.High kurapa simba DM-6535 Porcelain chena Unyoro kurapa 9000±2000 1±0.5 35±5 ≥800 ≥6 yakakwirira ≥1 ≥XNUMX yekutanga […]

Zviviri-chikamu Epoxy Adhesive

Chigadzirwa Maparamendi Chigadzirwa Model Chigadzirwa zita Ruvara Typical Viscosity (cps) Kurapa nguva Shandisa DM-630E AB epoxy adhesive Isina Ruvara kune zvishoma yero mvura mvura 9000-10,000 120min Inokodzera maapplication anoda kujeka kwemaziso, chimiro chakanakisa, mechanic uye magetsi ekudzivirira, kusungirira diki zvikamu potting, riveting uye laminating. Inogona kubatanidza zvinhu zvakawanda zvinosanganisira girazi, fiber optics, ceramics, simbi […]

Yakadzika tembiricha inorapa epoxy adhesive kune inonzwisa midziyo uye kuchengetedzwa kwedunhu

Product Specification Parameters Chigadzirwa Model Chigadzirwa Zita Ruvara Typical Viscosity (cps) Kurapa Nguva Kushandisa Distinction DM-6128 Low tembiricha kurapa epoxy adhesive Black 7000-27000 @80 ℃ 20min 60 ℃ 60min CCD/CMOS/Sensitive Electronic Components, Low tembiricha yekurapa inonamira sanganisira memori kadhi, CCD kana CMOS musangano. Ichi chigadzirwa chakakodzera kupora tembiricha yakaderera uye inogona kupa yakanaka […]

UV Moisture Dual Kurapa Adhesive

Zvinotaurwa Nechigadzirwa & Maparamendi Zita reChigadzirwa Zita reChigadzirwa 2 Rudzi Rwakajairika Viscosity (cps) Kusanganisa Ratio Yekutanga Fixation Nguva / Yakazara Fixation TG/°C Kuoma / D Kupisa Kuramba/°C Yakachengetwa Yakajairika Chigadzirwa Zvishandiso DM-6060F UV mwando huviri kurapa adhesive Translucent Chiedza Bhuruu. 18000 Single component

Conductive sirivheri glue ye chip kurongedza uye bonding

Chigadzirwa Chekutsanangurwa Maparamita Chigadzirwa Series Chigadzirwa Zita Chishandiso maitiro Conductive sirivheri guruu DM-7110 Nguva yekunamatira ipfupi zvakanyanya, uye hapazove nekuswededza kana waya kudhirowa matambudziko. Basa rekubatanidza rinogona kupedzwa nediki diki rekunamatira, iro rinochengetedza zvakanyanya mutengo wekugadzira uye marara. Inokodzera otomatiki glue kuburitsa, […]

Epoxy underfill chip level adhesive

Chigadzirwa Chinotsanangurwa Parameters Chigadzirwa Model Chigadzirwa Zita Rudzi Chaicho Viscosity (cps) Kurapa Nguva Shandisa Distinction DM-6513 Epoxy underfill bonding adhesive Opaque Creamy Yellow 3000 ~ 6000 @ 100 ℃ 30min 120℃ 15min 150 ℃ Reusable CSP-10 ℃ XNUMX ℃ ℃ XNUMXmin BSP B. component epoxy resin adhesive is reusable filled resin CSP (FBGA) kana BGA. Inorapa nekukurumidza nekukurumidza […]