DeepMaterial Industrial Adhesive Pruducts
ʻO Deepmaterial ka mea hana i nā epoxy adhesives me nā mea paʻakikī, metalbond, a me nā resins i hoʻopiha ʻia. Hāʻawi pū ʻia nā mea hoʻopili i kūkulu ʻia, paʻakikī, a me nā mea hoʻopili non-sag. Kūleʻa kekahi mau mea hoʻopili i ka haʻalulu wela, kemika, ka haʻalulu haʻalulu, a me ka hopena. He kūpono no nā metala, plastic, lāʻau, a me nā seramika. Lawelawe i nā mea uila, aerospace, automotive, mea hana, moana, a me nā ʻoihana kūkulu. ʻO REACH a me RoHS kūpono. Ua ʻae ʻia ʻo FDA. UL helu ʻia. Hoʻokō i nā kikoʻī koa. ʻO mākou kekahi o nā mea hana adhesive maikaʻi loa ma Kina.
Ua hoʻomohala ʻo DeepMaterial i nā mea hoʻopili ʻoihana no ka hōʻiliʻili chip a me ka hoʻāʻo ʻana, nā mea hoʻopili papa kaapuni, a me nā mea hoʻopili no nā huahana uila. Ma muli o nā adhesives, ua hoʻomohala ʻo ia i nā kiʻiʻoniʻoni pale, nā mea hoʻopihapiha semiconductor, a me nā mea hoʻopihapiha no ka hoʻoheheʻe ʻana i ka wafer semiconductor a me ka hōʻiliʻili chip a me ka hoʻāʻo.
No ka hāʻawi ʻana i nā mea hoʻopili uila a me nā mea hoʻohana uila kiʻiʻoniʻoni ʻoniʻoni a me nā hopena no nā ʻoihana kikowaena kamaʻilio, nā ʻoihana uila uila, nā ʻāpana semiconductor a me nā ʻoihana hoʻāʻo, a me nā mea hana mea kamaʻilio, e hoʻoponopono i nā mea kūʻai aku i ʻōlelo ʻia ma luna o ke kaʻina hana, nā huahana kiʻekiʻe kiʻekiʻe. , a me ka hana uila.
Hāʻawi ʻo DeepMaterial i nā ʻano huahana like ʻole e pili ana i ka hoʻopili ʻenehana no ka uila, UV curing UV adhesive series, reactive type of hot melt adhesive and pressure sensitive hot melt adhesiveseries, epoxy-based chip underfill a me COB encapsulation material series, circuit board protection potting and conformal coating adhesive. series, epoxy based conductive silver adhesive moʻo, structural bonding adhesive series, functional film moʻo pale, semiconductor pale pale kiʻiʻoniʻoni.
ʻO ka Microencapsulated Self-activating Fire Extinguishing Gel mai ka mea hana mea hana hoʻopau ahi paʻa.
ʻO Microencapsulated Self-activating Fire Extinguishing Gel Coating | Mea Pepa | Me ka Power Cord Cables Deepmaterial ʻo ia ka mea nāna i hoʻopau i ke ahi mea hana ma Kina, ua hoʻomohala i nā ʻano ʻano like ʻole o nā mea hoʻopau ahi perfluorohexanone ponoʻī i mea e hoʻolalelale ai i ka hoʻolaha ʻana o ka holo ʻana o ka wela a me ka mana deflagration i nā pihi ikehu hou. a me nā mea hoʻonā ahi ʻē aʻe […]
Pākuʻi Semiconductor & Hoʻāʻo ʻana i ke kiʻiʻoniʻoni kūikawā UV Viscosity Reduction
Nā ʻāpana kikoʻī Huahana Huahana ʻAno Huahana ʻAno Mānoanoa Peel Force Ma mua o UV Peel Force Ma hope o UV DM-208A PO+UV hoʻoemi hoʻoemi ʻana 170μm 800gf/25mm 15gf/25mm DM-208B PO+UV hōʻemi ʻia 170μm 1200gf/25mm 20mmgf/25mm +UV hoemi hoemi 208μm 170gf/1500mm 25gf/30mm
Led Scribing/Huli Crystal/Reprinting Semiconductor PVC Pale Film
Nā ʻāpana kikoʻī o ka huahana ʻAno Huahana ʻAno Mānoanoa Peeling Force DM-TDS-202RB PVC+acrylic 80μm 95 gf/25mm DM-TDS-202RT PVC+acrylic 80μm 95 gf/25mm DM-TDS-204RB PVC+acrylic 80μm 66 gf/25RB -TDS-204RT PVC+acrylic 80μm 66 gf/25mm
Ka palekana pale
Nā ʻāpana kikoʻī o ka huahana ʻAno Huahana ʻAno Mānoanoa Peeling Force Transmittance Haze Cape Verdict DM-302 PET+OCA Mānoanoa 70μm 1600 gf/25mm 93% <1.5% * DM-303 PET+TPU Mānoanoa 125μm 800 gf/25mm >90% 1°
ʻO ke kiʻiʻoniʻoni hoʻomalu aniani ʻano anti-static
Nā ʻāpana kikoʻī Huahana Huahana ʻAno Huahana ʻAno Mānoanoa Peeling ikaika DM-310 PET+acrylic 60μm <200gf/25mm DM-332 PET+Silicone 150μm 18~25gf/25mm DM-333 PET+Silicone 150μm 18~25gf+PTU/25mm0502 PU 60μm 3~6gf/25mm DM-PTU0501E PET+PU 60μm 3~6gf/25mm
Kiʻiʻoniʻoni Hoʻemi Hoʻemi ʻia ʻo Optical Glass UV Adhesion
Nā ʻāpana kikoʻī o nā huahana ʻAno Huahana ʻAno Mānoanoa Peel Force Ma mua o UV Peel Force Ma hope o UV DM-2005 PET+UV tack hoʻemi 65μm 1800gf/25mm 15gf/25mm DM-2010 PET+UV tack reduction 120μm 1800gf/25mm 15mmgf/25mm PVC +UV hoemi hoemi 206μm 90gf/350mm 25gf/8mm
Epoxy Encapsulant
Nā ʻāpana kikoʻī Huahana Huahana Huahana Inoa Huahana ʻO ke kala maʻamau Viscosity (cps) manawa hoʻomaʻamaʻa E hoʻohana i ka ʻokoʻa DM-6016E Epoxy potting adhesive ʻeleʻele 58000 ~ 62000 @ 150 ℃ 20min PCB papa hoʻokomo sensitive, transistors, kāleka kāleka IC kāleka kāleka maikaʻi. koi ʻia. Aia nā mea i ho'ōla ʻia no ka haʻalulu wela nui a hāʻawi i ka pale wela mau i […]
PUR hoʻopili kino
Nā ʻāpana kikoʻī Huahana Huahana Ke Ana Hoʻolāʻau ʻAla Hoʻoheheʻe i ka Viscosity (mPa.s/100°C) Nā hola wehe (min) Paʻa (D) Elongation (%) ʻO ka ikaika ʻāʻili ʻana (MPa) Nā hiʻohiʻona huahana DM-6542 ʻO ka melemele māmā ʻO ka wai hoʻōla 5000±1500 3±1 31±5 ≥810 ≥5 1. Hāʻawi i ka ikaika mua maikaʻi loa 2.Excellent elongation 3.High curing ikaika DM-6535 Porcelain white Moisture curing 9000±2000 1±0.5 35±5 ≥800 ≥6 ≥1 XNUMX. mua […]
ʻElua mau ʻāpana Epoxy Adhesive
Nā ʻāpana kikoʻī Huahana Huahana Huahana Inoa Huahana ʻO ke kala maʻamau Viscosity (cps) Ka manawa hoʻomaʻamaʻa E hoʻohana i ka DM-630E AB epoxy adhesive ʻAʻohe kala i ka wai melemele iki 9000-10,000 120min Kūpono no nā noi e koi ana i ka ʻike maka, ka hoʻolālā maikaʻi loa, ka mīkini a me ka uila uila, no ka hoʻopaʻa ʻana, liʻiliʻi. ʻāpana potting, riveting a laminating. Hiki ke hoʻopaʻa i ka hapa nui o nā mea me ke aniani, fiber optics, ceramics, metala […]
ʻO ka lāʻau epoxy hoʻōla haʻahaʻa haʻahaʻa no nā hāmeʻa koʻikoʻi a me ka pale kaapuni
Nā ʻāpana kikoʻī Huahana Huahana Huahana Inoa Huahana ʻAla ʻO ke ʻano Viscosity maʻamau (cps) Hoʻohana ʻana i ka manawa hoʻomaʻamaʻa ʻokoʻa DM-6128 Haʻahaʻa wela hoʻōla epoxy adhesive ʻeleʻele 7000-27000 @80℃ 20min 60℃ 60min CCD/CMOS/Sensitive Electronic Components Haʻahaʻa wela ho'ōla lāʻau adhesive, nā noi maʻamau e komo pū me ke kāleka hoʻomanaʻo, CCD a i ʻole CMOS hui. He kūpono kēia huahana no ka ho'ōla wela haʻahaʻa a hiki ke hāʻawi i ka maikaʻi […]
ʻO ka hoʻopili ʻana o UV Moisture Dual Curing Adhesive
Nā kikoʻī a me nā ʻāpana inoa inoa huahana 2 kala maʻamau ʻo Viscosity maʻamau (cps) hui pū ʻana i ka manawa hoʻopaʻa mua / paʻa piha TG/°C paʻakikī/D pale wela / ° C mālama ʻia nā noi huahana maʻamau DM-6060F UV moisture dual curing adhesive Translucent Light Blue 18000 ʻāpana hoʻokahi <10s@100mW/cm 2Humidity 8 lā 75 76 -55°C-120°C 2-8°C ʻAʻole kahe, UV/moisture curing encapsulation no ka kaapuni topical [...]
ʻO ke kāpili kala kala no ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana
Nā ʻāpana kikoʻī o ka Huahana Huahana Huahana Inoa Huahana Nā hiʻohiʻona noiʻi Conductive silver glue DM-7110 He pōkole loa ka manawa pipili, ʻaʻohe pilikia kiʻi huelo a uea paha. Hiki ke hoʻopau ʻia ka hana hoʻopaʻa ʻana me ka liʻiliʻi liʻiliʻi o ka adhesive, kahi e mālama nui ai i nā kumukūʻai hana a me nā ʻōpala. He kūpono ia no ka hāʻawi ʻana i ka glue maʻalahi, […]
Epoxy underfill chip level adhesive
Nā ʻāpana kikoʻī o ka huahana Ke Ana Hoʻohālike Huahana Huahana ʻO ke kala maʻamau ʻo Viscosity maʻamau (cps) Hoʻohana ʻia ka manawa hoʻomaʻamaʻa ʻokoʻa DM-6513 Epoxy underfill bonding adhesive Opaque Creamy Yellow 3000~6000 @ 100℃ 30min 120℃ 15min 150℃ 10min Reusable CSP (FBGA Hoʻokahi) ʻO ka ʻāpana epoxy resin adhesive he mea hiki ke hoʻohana hou i ka resin CSP (FBGA) a i ʻole BGA. Hoʻōla koke ia i ka wā […]
