E pili ana i nā mea hoʻopili ʻoihana
ʻO Shenzhen Deepmaterial Technologies Co., Ltd kahi mea hana ʻenehana adhesives koʻikoʻi me ka ʻike e hana i nā ʻano hoʻopili no kēlā me kēia huahana a noi paha. Loaʻa i nā Deepmaterial Adhesives nā mea hiki ke hana i nā adhesives e like me ka viscosity, ka ikaika paʻa, ka mahana noi, a me nā mea hou aku. ʻO kā mākou mau mea hoʻopili ʻoihana e pili ana i nā mea hoʻoheheʻe wela, nā mea hoʻopili koke, nā mea hoʻopili paʻakikī, nā threadlockers, nā mea hoʻopili a me nā mea hou aku, e hāʻawi i ka hana maikaʻi loa, ka ʻoluʻolu, a me ka hilinaʻi ʻaʻohe mea e pono ai kāu ʻoihana a noi paha.
ʻO nā mea hoʻopili ʻenehana nā mea hoʻohui kemika a me nā mea hoʻohui i hoʻohana ʻia e hoʻohui i nā ʻāpana. ʻO nā huahana ka acrylic, epoxy, wela wela, polyurethane, silicone, thermoset, a me UV curing adhesives, a me nā sealants ʻoihana. Hoʻohana ʻia ka hapa nui o nā mea hoʻopili ʻoihana i nā noi hoʻopaʻa. Hoʻohana ʻia nā sealants ʻoihana e hoʻopiha i nā āpau ma waena o nā hili, a ma luna paha; a me ka loaʻa ʻana o ka wai, pale i ka leak, a pale i ke komo ʻana o nā mea makemake ʻole.
Mai nā mea hoʻopili i hana mua ʻia, ka lipine a me ka hoʻopaʻa inoa ʻana i nā mea hoʻopili, hoʻopili, automotive a me nā uila, a i ʻole nā mea hana maʻamau. Hoʻohana ʻia nā mea hoʻopili ʻoihana e hoʻopaʻa i nā substrate like ʻole ma o ka hoʻopili ʻana (ka hoʻopaʻa ʻana i luna) a me ka cohesion (ikaika kūloko).
Inā pono ʻoe, loaʻa iā mākou. A inā ʻaʻole mākou, e hana mākou. ʻAe, hiki iā ʻoe ke hana i nā mea hoʻopili i ka mea āu e makemake ai ma Deepmaterial.
Hoʻoikaika ʻia e ka makemake e hana hou, hana, hoʻoponopono a lawelawe, hoʻomohala a hana mākou i nā ʻano like ʻole o ka hopena adhesive hiki ke noʻonoʻo ʻia. Hoʻohana pū mākou i nā mea hoʻopili maʻamau no nā mea kikoʻī.
ʻO nā mea hoʻopili hohonu, nā mea hoʻopaʻa a me nā mea hoʻopihapiha no nā ʻenehana uila
Loaʻa ka ʻenehana uila ma nā wahi āpau o ko mākou ola. E like me ka hoʻokele ʻana i nā kaʻa hybrid a me nā kaʻa uila me nā ʻōnaehana kōkua hoʻokele holomua, e hoʻohana i nā smartphones e hoʻokele i kā mākou hana a pāʻani, e ʻike i kahi honua hou ma o nā headset augmented reality (AR), e leʻaleʻa i ka leʻaleʻa pilikino i ka wā e lele ana i nā mokulele, a mālama i ko mākou wahi noho. ma o na mea pili hale. Akā, i nā makahiki i hala aku nei, he moeʻuhane wale nō ka hapa nui o kēia mau mea hou.
ʻO Deepmaterial ka mea hana mua a me ka mea hoʻolako no ka hui uila a me nā ʻoihana semiconductor packaging. Hoʻokomo ʻia kā mākou papa hana kiʻekiʻe i kahi ʻano o nā huahana e hoʻomaʻamaʻa i ka pilina uila, hāʻawi i ka kūpaʻa ʻana, hāʻawi i ka pale koʻikoʻi, a me ka hoʻololi ʻana i ka wela no ka hana hilinaʻi. Haʻaheo mākou i ka hana ʻana i nā huahana hou aʻe e kākoʻo ana i nā ʻenehana uila hou loa.
Hāʻawi nā Adhesives i kahi paʻa paʻa i ka wā o ka hui uila me ka pale ʻana i nā ʻāpana mai ka pōʻino.
ʻO nā mea hou hou i loko o ka ʻoihana uila, e like me nā kaʻa hybrid, nā mea uila kelepona paʻa, nā noi lāʻau, nā kiʻi kamepiula, nā kamepiula, nā kelepona pale, a me nā poʻo poʻo ʻoiaʻiʻo i hoʻonui ʻia, pili kokoke i nā wahi āpau o ko mākou ola. He ʻāpana koʻikoʻi nā mea uila uila i ka hui ʻana i kēia mau ʻāpana, me ka nui o nā ʻenehana adhesive like ʻole i loaʻa e hoʻoponopono i nā pono noi kikoʻī.
Hāʻawi nā Adhesives i kahi paʻa paʻa i ka wā e pale ana i nā ʻāpana e kūʻē i nā hopena pōʻino o ka haʻalulu nui, ka wela, ka makū, ka ʻino, ka haʻalulu mechanical, a me nā kūlana kūlohelohe. Hāʻawi pū lākou i nā waiwai thermal a me nā uila conductive, a me nā mana hoʻōla UV.
Hoʻolālā ʻia e hoʻokō i nā koi o kēia lā no ka ikaika, ka lōʻihi a me ka versatility
ʻO ka hoʻonui ʻana i ka hana nui a me ka miniaturization o nā mea uila e koi aku i nā kaʻina hana hoʻopaʻa ʻoi aku ka wikiwiki, ikaika a pololei i nā substrate hou. Ma Bostik, maopopo mākou i ka paʻakikī e lawe mai nei i ka wā e kamaʻilio ai:
* Pono pono noi
* Nā koi hoʻolālā
* Koi nani
I kēia lā, ʻo ka ʻenekinia adhesives ka hopena mua no ka hui ʻana i nā kaʻa uila, nā kelepona, nā lāʻau lapaʻau a me nā mea uila ʻē aʻe.
Hōʻikeʻike ʻo Deepmaterial Electronic Grade System i nā ʻano hana ʻokoʻa
Hiki ke hoʻohana ʻia nā huahana a loaʻa no ka hoʻohana ʻana i nā applicators kūpono (me nā syringes premixed a me ka hau hau no nā ʻōnaehana epoxy ʻelua). ʻO nā waiwai o nā māka kikoʻī:
*Ka ikaika paʻa kiʻekiʻe i nā substrate like a like ʻole
*Ke kaumaha haʻahaʻa
* Hiki ke lawelawe wela kiʻekiʻe/haʻahaʻa
* Ho'ōla wikiwiki
* Ke kū'ē i ka wai a me nā mea kemika he nui
*Ka helu haʻahaʻa o ka hoʻonui wela
Hāʻawi nā ʻōnaehana Silicone i ka palekana maikaʻi loa mai ke koʻikoʻi mīkini a me ka hoʻololi ʻana o ka wela
Hoʻokahi a ʻelua ʻāpana uila i loaʻa i ke kūpaʻa wela kiʻekiʻe, moduli haʻahaʻa o ka elasticity, nā waiwai dielectric kiʻekiʻe. ʻO nā hiʻohiʻona maikaʻi ʻē aʻe o nā pūhui silicone i koho ʻia penei:
*Ka emi haʻahaʻa
* Ka hoʻoili wela a me ka uila
* Haʻahaʻa outgassing
* Kemika inertness
*Haʻahaʻa haʻahaʻa haʻahaʻa
*Kuhi haʻalulu
ʻAʻohe hui UV/ʻike ʻia Light Curing Compounds no ka pale ʻana i nā ʻāpana uila
ʻO ka hoʻōla wikiwiki ʻana i kahi ʻāpana manuahi manuahi e hōʻike ana i ka ikaika paʻa kiʻekiʻe, ke kūpaʻa kūlohelohe no nā noi hui uila. ʻO nā pūhui viscosity haʻahaʻa no ka uhi conformal a me nā pūhui viscosity kiʻekiʻe no nā noi glob top i hana ʻia e pale aku i ka abrasion, moisture, vibration and thermal cycling exposure.
Hoʻohana ʻia nā mea hoʻopili māmā, nā uhi a me nā encapsulants i ka ʻoihana hana uila me ka hoʻonui pinepine ʻana no ka mea ua hoʻokō lākou i nā koi no nā mea a me ka hana ʻana i loko o kēia ʻoihana. ʻO ia mau mea e pili ana i nā koi kaiapuni (ʻaʻole koi ʻia nā solvents e hōʻino i ke kaiapuni a me nā mea hoʻohui), ka hoʻomaikaʻi ʻana i ka huahana a me ke kumukūʻai huahana. He mea maʻalahi ka hoʻohana ʻana i nā mea hoʻopili māmā, a hoʻōla koke ʻia me ka ʻole o ka hoʻōla ʻana i ka wela kiʻekiʻe.
ʻO nā mea hoʻopili maʻamau he acrylic-based formulations a loaʻa nā kiʻi hoʻomaka i ka wā e hoʻāla ʻia e ka radiation ultraviolet, e hana i nā radical manuahi e hoʻomaka i ke kaʻina hana polymer-forming (curing). Pono ke kukui Ultraviolet e komo i loko o ka resin i hoʻomaʻemaʻe ʻole ʻia - he drawback o nā mea hoʻopili uila. He paʻakikī ke hoʻōla ʻia nā waiho ʻana o ka resin ʻeleʻele, hiki ʻole a mānoanoa loa.
Potting a me ka encapsulation
He ʻano hana ʻo Potting no ka hoʻopiha ʻana i nā wahi liʻiliʻi a i ʻole nā luna me kahi mea e pale ai i nā ʻāpana mai ka pōʻino kino a me ke kaiapuni. Hāʻawi pū nā ʻāpana potting i ka hiki ke insulation hou.
Hōʻike maʻamau nā pūhui potting i nā waiwai kemika maikaʻi a me ka pili kiʻekiʻe i nā plastics a me nā metala, ʻo ia nā mea hana o nā ipu a me nā ʻāpana.
ʻO nā resins maʻamau i hoʻohana ʻia no ka potting he epoxies, polyurethanes, silicones a me nā acrylics, ʻo ia ka mea maʻamau i nā ʻano hoʻoponopono UV-curing.
Ma waho aʻe o ka potting, aia kekahi mau ʻano hana e hoʻopili ai i nā mea uila, ʻo ia hoʻi ka hoʻolei ʻana a me ka hoʻoheheʻe ʻana. Hoʻohana ʻia ka hoʻoheheʻe ʻana i nā ʻano resins adhesive e like me ka ipuhao, ʻoiai ʻo ka pahu (waho o waho) e wehe pinepine ʻia ma hope o ka hoʻōla ʻana o ka resin, ʻaʻole like me ke kaʻina hana potting kahi i lilo ai ka ipu i mea nui o ka mea. Hoʻopili pinepine ʻia ka hoʻoheheʻe ʻana i nā resins thermoplastic i hoʻoheheʻe ʻia i loko o kahi poni i loaʻa nā ʻāpana uila a i ʻole circuitry.
Nā mea hoʻopili uila
Ma muli o ko lākou ʻano, ʻo ka hapa nui o nā mea hoʻopili, nā mea kūlohelohe a me nā mea ʻokoʻa, ʻaʻole ia he uila uila. Pili kēia i nā ʻano nui i hoʻohana ʻia i nā noi uila e like me nā epoxies, acrylics, cyanoacrylates, silicones, urethane acrylates a me cyanoacrylates. Eia nō naʻe, i loko o nā noi he nui, e komo pū ana me nā kaapuni i hoʻohui ʻia a me nā ʻaoʻao mauna i luna, pono nā mea hoʻopili uila.
ʻO ke ala maʻamau o ka hoʻololi ʻana i nā mea hoʻopili non-conductive i nā mea uila conductive e hoʻohui i ka hoʻopiha kūpono i ka mea kumu; ʻO ka mea maʻamau ka mea hope he resin epoxy. ʻO nā mea hoʻopihapiha maʻamau i hoʻohana ʻia e hāʻawi i ka conductivity uila he kālā, nickel a me carbon. ʻO ke kālā ka mea i hoʻohana nui ʻia. ʻO nā mea hoʻopili conductive iā lākou iho i loko o ka wai a i ʻole ke ʻano mua (e ʻoki ʻia nā kiʻi ʻoniʻoni i hoʻoikaika ʻia ma mua o ka hoʻopaʻa ʻana i ke ʻano i makemake ʻia).
Nā mea hoʻopili thermally conductive
ʻO ka hoʻohaʻahaʻa ʻana i ka uila uila hiki ke hopena i nā pilikia o ke kūkulu ʻana i ka wela, hiki ke hoʻopau i ka wā mua o nā ʻāpana uila inā ʻoi aku ka nui o ka mahana hana. Hiki ke hoʻohana ʻia ka mea hoʻopili wela wela e hāʻawi i kahi ala hoʻokele wela, nā transistors hoʻopaʻa, nā diodes a i ʻole nā mea mana ʻē aʻe i kūpono i nā puʻu wela e hōʻoia i ka loaʻa ʻole o ka hana wela.
Hoʻohui ʻia nā pauka metallic (electrically conductive) a i ʻole metallic (insulating) i loko o ka hoʻopili hoʻopili e hana i nā mea hoʻopili kiʻekiʻe-viscosity (paste), i hoʻohālikelike ʻia me nā mea hoʻopihapiha ʻole. Hoʻokumu ʻia nā ʻōnaehana thermally conductive maʻamau me ka epoxy, silicone a me nā acrylics.
Mai ka hoʻopili uea kūikawā a me ka encapsulation coil i ka hui ʻana o nā mea leo a me ke kau ʻana, hāʻawi ʻo Deepmaterial i nā ʻano huahana adhesive hana kiʻekiʻe no nā noi uila i ka mākeke hui.
